Leadframe and semiconductor package made using the leadframe

ABSTRACT

Metal leadframes, semiconductor packages made using the leadframes, and methods of making the leadframes and packages are disclosed. In one embodiment, the leadframe includes a rectangular frame. A chip pad and a plurality of leads are within the frame. The lower side of the chip pad and the leads includes one or more vertically recessed horizontal surfaces. The upper side of the chip pad may include a groove around a chip mounting region. In a package, the chip pad supports a semiconductor chip electrically connected to the leads. The lower side of the chip pad and leads are exposed at an exterior surface of the package body. Encapsulant material underfills the recessed lower surfaces of the chip pad and leads, thereby locking them to the encapsulant material. A wire may be reliably bonded to the chip pad within the groove formed in the upper side thereof.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of U.S. application Ser. No.11/372,597 entitled LEADFRAME AND SEMICONDUCTOR PACKAGE USING THELEADFRAME filed Mar. 10, 2006 and issued as U.S. Pat. No. 8,410,585 onApr. 2, 2013, which claims priority to U.S. application Ser. No.09/845,601 entitled LEADFRAME AND SEMICONDUCTOR PACKAGE USING THELEADFRAME filed Apr. 26, 2001 and issued as U.S. Pat. No. 7,042,068 onMay 9, 2006, which claims priority to Korean Patent Application Nos.2000-22590 filed Apr. 27, 2000, 2000-41644 filed Jul. 20, 2000, and2000-63021 filed Oct. 25, 2000. Each patent application identified aboveis incorporated herein by reference in its entirety to providecontinuity of disclosure.

BACKGROUND OF THE INVENTION

A typical package for a semiconductor chip includes an internalleadframe, which functions as a substrate for the package. The leadframeincludes a central metal chip pad and a plurality of leads. A body of ahardened, insulative encapsulant material covers the chip, chip pad, andan inner portion of each of the leads. The encapsulant material isprovided both above and below the chip pad and leads.

The semiconductor chip is mounted on the chip pad and is electricallyconnected to the leads. In particular, the chip includes a plurality ofbond pads, each of which is electrically connected by a conductor (e.g.,a wire) to an encapsulated inner portion of one of the leads. An outerportion of each lead extends outward from the body of encapsulantmaterial, and serves as an input/output terminal for the package. Theouter portion of the leads may be bent into various configurations, suchas a J lead configuration or a gull wing configuration.

Lately, practitioners have attempted to make packages thinner byproviding the chip pad and leads at a bottom surface of the body ofencapsulant material, rather than in the middle of the body ofencapsulant material. Such packages enjoy a lower height than thestandard leadframe packages mentioned above, since there is noencapsulant beneath the chip pad and leads.

In addition, there is a demand for smaller and smaller packages.Leadframes for such packages have themselves become smaller and thinner.

BRIEF SUMMARY

The present invention includes leadframes, semiconductor packages madeusing the leadframes, and methods of making the leadframes and packages.The packages of the present invention can be made very thin, because theleads are exposed at a bottom surface of the encapsulant material.Moreover, the packages are reliable, because encapsulant material isprovided under one or more portions of the leads, thereby locking theleads to the package body of encapsulant material. Further, encapsulantmaterial can be provided under a peripheral lip of a chip pad upon whichthe chip is mounted, thereby locking the chip pad to the encapsulantmaterial.

For instance, a metal leadframe in accordance with one embodiment of thepresent invention includes a rectangular frame. A chip pad is inside ofand integrally connected to the frame. A plurality of leads extend fromthe frame toward the die pad. Each lead includes an inner end adjacentto the chip pad, an outer end integrally connected to the frame, a firstsurface, and a second surface opposite the first surface. The secondsurface of each lead is split into a first region and a second region bya groove including a recessed horizontal third surface that extendsacross the lead. The first region of the second surface of the lead isbetween the frame and the third surface, and the second region isbetween the third surface and the inner end of the lead. The chip padmay include a first surface, a second surface opposite a central portionof the first surface, and a third surface opposite a peripheral portionof the first surface and surrounding the second surface. The thirdsurface is recessed from the second surface. The first surface of thechip pad may include a groove extending in a ring adjacent to peripheralsides of the chip pad.

A semiconductor package in accordance with another embodiment of theinvention may be made from such a leadframe. A semiconductor chip ismounted on the first surface of the chip pad and is in an electricalconnection with the first surface of at least some of the leads. Apackage body of a hardened encapsulant material covers the chip, atleast the first surface of the chip pad, and the first surface and thirdsurface of the leads. The first and second regions of the second surfaceof the leads, and typically the second surface of the chip pad, areexposed in a plane of a first exterior surface of the package body forexternally connecting the package to a motherboard or the like. Further,in the case where a groove is formed in the first surface of the diepad, the groove may surround the chip, and the chip may be electricallyconnected to the chip pad by a wire bonded within the groove.

These and other aspects of the present invention may be betterappreciated upon consideration of the exemplary embodiments that areshown in the figures and discussed below.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1a is a top plan view of a leadframe according to a firstembodiment of the present invention;

FIG. 1b is a bottom plan view of the leadframe according to the firstembodiment of the present invention;

FIG. 1c is a cross-sectional side view of the leadframe according to thefirst embodiment of the present invention;

FIG. 2a is a bottom plan view of a leadframe according to a secondembodiment of the present invention;

FIG. 2b is a cross-sectional side view of the leadframe according to thesecond embodiment of the present invention;

FIG. 3a is a top plan view of a leadframe according to a thirdembodiment of the present invention;

FIG. 3b is a bottom plan view of the leadframe according to the thirdembodiment of the present invention;

FIG. 3c is a cross-sectional side view of the leadframe according to thethird embodiment of the present invention;

FIG. 4a is a cross-sectional side view of a semiconductor package madeusing the leadframe of FIGS. 1a through 1 c;

FIG. 4b is a bottom plan view of the semiconductor package made usingthe leadframe of FIGS. 1a through 1 c;

FIG. 5a is a cross-sectional side view of a semiconductor package madeusing the leadframe of FIGS. 2a and 2 c;

FIG. 5b is a bottom plan view of the semiconductor package made usingthe leadframe of FIGS. 2a and 2 b;

FIG. 6a is a cross-sectional side view of a semiconductor package madeusing the leadframe of FIGS. 3a through 3c ; and

FIG. 6b is a bottom plan view of the semiconductor package made usingthe leadframe of FIGS. 3a through 3 c.

DETAILED DESCRIPTION

The present invention will now be described in connection with theexemplary embodiments described below with reference to the accompanyingdrawings.

First, FIGS. 1a through 1c are a top plan view, a bottom plan view and across-sectional side view, respectively, of a leadframe 101 according toa first embodiment of the present invention. FIGS. 2a and 2b are abottom plan view and a cross-sectional side view of a leadframe 102according to a second embodiment of the present invention. FIGS. 3athrough 3c are a top plan view, a bottom plan view and a cross-sectionalside view of a leadframe 103 according to a third embodiment of thepresent invention. In FIGS. 1b, 2a, 3a, and 3b , the shaded areas arevertically recessed from the laterally adjacent non-shaded surfaces.FIGS. 4a and 4b are a cross-sectional side view and a bottom view,respectively, of a semiconductor package 201 made using the leadframe101 of FIGS. 1a through 1c . FIGS. 5a and 5b are a cross-sectional sideview and a bottom view, respectively, of the semiconductor package 202made using the leadframe 102 of the FIGS. 2a and 2b . Finally, FIGS. 6aand 6b are cross-sectional side view and bottom plan view, respectively,of a semiconductor package 203 made using the leadframe 103 of FIGS. 3athrough 3c . In the drawings, like features typically have the samereference numbers, in which case the same discussion applies across thevarious embodiments.

Generally, a leadframe for a semiconductor package is manufactured bymechanically stamping or chemically etching continuous metal strips.

The leadframes 101, 102 and 103 may be made of a common leadframe metal,such as copper (Cu), copper alloy (Cu Alloy), Alloy 37 (nickel(Ni) 37%and steel(Fe) 55%) and copper-plated steel, according to theapplication.

Referring to leadframe 101 of FIGS. 1a, 1b, and 1c , a plate type frame2, which encloses a space of a prescribed size, is formed at the centerof the leadframe. A rectangular chip pad 6 is at the center of the spacewithin the frame is connected at its four corners and supported by fourtie bars 4. Each tie bar 4 is integrally connected between an inner endof any one of a plurality of leads 8 extending inward from the frame 2and a corner of chip pad 6. In this example, the tie bars 4 are eachintegrally connected to a lead 8 that is adjacent to a corner of frame2.

A plurality of leads 8 extend inward from frame 2. An outer end of eachlead 8 is integrally connected to the frame 2 and the opposite inner endof the lead 8 is either connected to a tie bar 4 or is a free end thatextends to a point adjacent to, but not contacting, chip pad 6.

In leadframe 101, the inner end of the leads 8 that are not connected toa tie bar 4, i.e., the free inner ends, extend from frame 2 toward chippad 6. There are 32 such leads 8, with eight leads 8 between pairs ofthe tie bars 4.

The free end of some of the leads 8 that are directed toward chip pad 6are bent at angles toward chip pad 6. The bend helps to lock the lead 8to encapsulant material later applied to the leadframe. Each lead 8 mayhave an anchor ear 10 projecting from a side of the lead 8. The anchorear 10 serves to restrict an encapsulant 18 (see FIG. 4a ) in thefinished semiconductor package as well as to prevent the lead 8 frombeing pulled out from encapsulant 18 horizontally or vertically.Selectively, to further restrict the encapsulant 18, a concave hole or adepressed part may be formed in the lead 8 in place of the anchor ear10. It will be appreciated that the anchor ear 10 is optional.

Here, the number, position and path of the leads 8 of the leadframes101, 102 and 103 described herein are exemplary only, and may be changedaccording to the application. Furthermore, the leads 8 may be designedsuitable for the number and position of input-output pads 14 of asemiconductor chip 12 (see FIG. 4a ) to be mounted on the leadframe.Additionally, in the drawings, the leadframes 101, 102 and 103 are inthe form of a square, but may be in the form of a non-equilateralrectangle. Moreover, in the drawings, the leads 8 are formed adjacent toall four sides of chip pad 6, as in a quad package, but may be formedadjacent to only two parallel sides of chip pad 6, as in a dual package.Also, only two tie bars 4 may be formed to support chip pad 6. Further,the tie bars 4 may be integrally connected between frame 2 and chip pad6 rather than between a lead 8 and chip pad 6.

Chip pad 6 of leadframe 101, 102, and 102, includes a first surface 6 aof approximately flat type, a second surface 6 b of approximately flattype opposed to a central portion of first surface 6 a, and a thirdsurface 6 c of approximately flat type opposed to a peripheral portionof the first surface 6 a. The third surface 6 c is vertically recessedin a predetermined interval from the second surface 6 b. Third surface 6c extends fully around second surface 6 b and chip pad 6, so as to forma lip beginning at first surface 6 a and ending a selected distance fromsecond surface 6 b.

A center area of the chip pad 6 has a first thickness between the firstsurface 6 a and the second surface 6 b. A peripheral area around chippad 6 has a second thickness between first surface 6 a and third surface6 c that is less (e.g., about half) than the first thickness. The shadedparts in FIGS. 1b, 2a, and 3a indicate the third surface 6 a in anembodiment where third surface 6 c circumscribes chip pad 6.

Alternatively, with reference to FIGS. 3a and 3c , chip pad 6 may have agroove bottomed by a horizontal fourth surface 6 d formed in the firstsurface 6 a and leadframe 103 opposed to the second surface 6 b. Fourthsurface 6 d is depressed a predetermined depth in a peripheral region offirst surface 6 a, and the semiconductor chip 12 is mounted inward ofthe groove (see FIG. 6a ). For an example, the groove having fourthsurface 6 d may be in the form of a rectangular ring located inward ofthird surface 6 c adjacent a periphery of chip pad 6, with chip 12located within the ring (see FIGS. 3a, 3c, and 6b ).

The shaded part of FIGS. 1b, 2a, 3b and tie bar 4 have the same secondthickness as is between the first surface 6 a and the third surface 6 cof the chip pad 6. That is, the underside of tie bars 4 also arerecessed.

Referring to FIGS. 1c, 2b, and 3c , the lead 8 includes a first surface8 a of approximately flat type and a second surface 8 b of approximatelyflat type opposed to the first surface 8 a. In FIGS. 1c, 2b, and 3c ,the reference letter S indicates a virtual sawing line through leads 8where the leads are cut during a manufacturing process to singulate thesemiconductor package. The package also can be singulated by punchingthrough the leads 8 at line S.

Referring to leadframe 101 of FIGS. 1b and 1c , a horizontal recessedthird surface 8 c may be provided opposite first surface 8 a in a groovein second surface 8 b across lead 8. Therefore, two regions of secondsurface 8 b exist on each lead on either side of third surface 8 c. Thefirst region of second surface 8 b is between frame 2 and third surface8 c and the second region of second surface 8 c is between third surface8 c and the inner end of lead 8. Optionally, a horizontal fourth surface8 d may be provided opposite first surface 8 a and recessed from secondsurface 8 b beginning at the inner end of the lead 8 immediatelyadjacent to chip pad 6. Anchor ears 10 also are recessed from secondsurface 8 b of lead 8.

Referring to leadframe 102 of FIGS. 2a and 2b , the recessed horizontalthird surface 8 c of the leads 8 also may be formed in an area of thesecond surface 8 b close to frame 2 and at sawing line S, so that thereis only one region of second surface 8 b. Optionally, a recessedhorizontal fourth surface 8 d may be formed beginning at the inner endof the lead 8 adjacent chip pad 6 and extending to second surface 8 b,as described above. In this embodiment, the single area of secondsurface 8 b is fully inward of the inner and outer ends of the lead 8.

Referring to leadframe 103 of FIGS. 3b and 3c , second surface 8 bextends to sawing line S and frame 2. A horizontal fourth surface 8 d isrecessed from second surface 8 b at the inner end of the lead 8. Anchorear 10 also is recessed from second surface 8 b. There is no thirdsurface 8 c as in leadframe 101.

Referring to FIGS. 1c, 2b, and 3c , leads 8 have a first thicknessbetween first surface 8 a and second surface 8 b, and a lesser secondthickness (e.g., 50% less) between first surface 8 a and the recessedthird and fourth surfaces 8 c and 8 d. Typically these first and secondthicknesses of leads 8 are the same as the first and second thicknessesmentioned above for chip pad 6.

In packages made from leadframe 101, 102, and 103, the second surface 8b formed either as one or two regions on the leads 8 serves toelectrically connect the semiconductor package 201, 202, and 203 (seeFIGS. 4a, 4b, 6a, 5b, 6a, and 6b ) to the mother board, therebyindirectly connecting packaged chip 12 to the motherboard. The firstsurface 6 a, the recessed third surface 6 c and the optional fourthsurface 6 d of the chip pad 6, and the first surface 8 a, the recessedthird surface 8 c, and the recessed optional fourth surface 8 d of thelead 8 are all located inside encapsulant 18. The recessed lower thirdsurfaces 6 c, 8 c, and fourth surface 8 d are underfilled by encapsulant18. The thickness of the chip pad 6 and the leads 8 of the leadframes101, 102 and 103 may be about 0.15 mm to 0.50 mm and the depth of therecess formed by the third surfaces 6 c, 8 c, fourth surface 8 d, andfourth surface 6 d may be about 0.075 mm to 0.25 mm. As the percentage,the depth of the recessed part formed by the third surfaces 6 c, 8 c,fourth surface 8 d, and the fourth surface 6 d may be about 50% or 33%to 75% of the total thickness of the chip pad 6 or lead 8. Of course,these values are example values. Real values may be changed according tothe application.

The leadframes 101, 102 and 103 may be formed of a milled metal strip bya common chemical wet etching process. As known, chemical etching(called also chemical milling) uses photolithography, photoresist and achemical solution for etching a pattern into the metal strip are used.Generally, the photoresist layer is formed on one side or two sides ofthe strip. Next, the photoresist layer is exposed to light through amask, on which a desired pattern is formed. The chemical solution isapplied to the one or two sides of the strip. The exposed areas of thestrip are etched and removed, and thereby the desired pattern remains inthe metal strip.

By performing the etching twice, the leadframes 101, 102 and 103 can beformed. The first etching step is carried out on the one or two sides ofthe strip through a photoresist pattern on the one or two sides of thestrip. The first etching step completely passes through predeterminedregions of the metal strip in order to form the overall pattern ofleadframes 101, 102 and 103.

Next, to form the recessed regions, a second photoresist pattern isformed on predetermined areas of one side or two sides of the leadframes101, 102 and 103. For example, a circumferential area of the chip pad 6and a selected area of the lead 8 are not covered by the secondphotoresist pattern, and therefore, are etched by a second etching step.The second etching step is carried out on the one or two sides of theleadframes 101, 102 and 103 through the second photoresist pattern. Asshown in FIGS. 1b, 1c, 2a, 2b, 3a and 3b , in the second etching step,the depressed surfaces are formed in the leadframes 101, 102 and 103.For example, the third surface 6 c and the fourth surface 6 d of chippad 6, and third surfaces 8 c and fourth surface 8 d of the leads 8 areformed during the second etching step. Anchor ears 10 and tie bars 4 arealso partially removed in their thicknesses by the second etching step.

During the second etching step, after the chemical solution removes adesired amount of the vertical thickness of the chip pad 6, leads 8anchor ears 10, and tie bars 4, the second etching step is stopped. Thesecond etching step is carried out in such a manner that the recessedlower surfaces of chip pad 6 and leads 8 will be within encapsulant 18of the package to be formed with leadframes 101, 102, and 103 (see FIGS.4a, 5a, and 6a ), e.g., the encapsulant 18 fills in under the thirdsurface 6 c of the chip pad 6 and the third surface 8 c and fourthsurface 8 d of the leads 8.

In general, in the second etching step, the thickness of the selectedareas of chip pad 6 and leads 8 is removed to about 50% of theiroriginal thickness, but the amount removed may be within the range ofabout 33% to 75% of the thickness of the leadframe, depending on theapplication. The second surface 6 b of chip pad 6 and the inner end ofsecond surface 8 b of leads 8 have rounded inner ends in the embodimentsshown in FIGS. 4b, 5b, and 6c . This may reduce package stresses.Additionally, the leadframes 101, 102, or 103 may be formed by a firststep of mechanically stamping the whole pattern of the leadframe and bya second step of chemically etching partially through the chip pad 6 andthe lead 8 of the stamped leadframe and other portions of the leadframeto form the recessed surfaces.

Meanwhile, after the etching step, the first surface 8 a of the lead 8of the leadframes 101, 102 and 103 may be plated with metal, such asgold(Au), silver (Ag), nickel (Ni), palladium (Pd), copper (Cu) andothers, in order to better bond to conductive wires 16 of the package(see FIGS. 4a, 5a, and 6a ). Furthermore, to facilitate connection ofthe second surface 8 b of the leads 8 to the mother board, the secondsurface 8 b may be plated with a metal such as gold, nickel, palladium,inconel, solder of lead and tin, or tantalum.

Referring to FIGS. 4a and 4b , the semiconductor package 201 includeschip pad 6 and a plurality of leads 8. The chip pad 6 has the firstsurface 6 a of approximately flat type, the second surface 6 b ofapproximately flat type opposite a central portion of first surface 6 a,and the encapsulant-covered third surface 6 c of approximately flattype. The third surface 6 c is opposed to a peripheral portion of thefirst surface 6 a fully around second surface 6 b. The third surface 6 cis vertically recessed from second surface 6 b.

The leads 8 of semiconductor package 201 extend toward the chip pad 6without contacting to the chip pad 6. Each lead 8 has the first surface8 a of approximately flat type, the second surface 8 b of approximatelyflat type, the third surface 8 c of approximately flat type, and anoptional fourth surface 8 d of approximately flat type. The secondsurface 8 b, the third surface 8 c and the fourth surface 8 d areopposed to respective portions of the first surface 8 a. The thirdsurface 8 c and fourth surface 8 d are vertically between the firstsurface 8 a and the second surface 8 b, i.e., are vertically recessedfrom second surface 8 b.

Here, the frame of the leadframe is removed along the sawing line S (seeFIG. 1c ) in a sawing step or punching step of the manufacturing processof the semiconductor package, wherein a finished package is singulatedfrom the strip of leadframes. A small stub including the outer end ofleads 8 may extends beyond the peripheral sides of encapsulant 18.

Referring to FIGS. 4a and 4b , third surface 8 c is within a horizontalgroove that splits second surface 8 c between the peripheral edge ofencapsulant 18 and fourth surface 8 d. Fourth surface 8 d begins at theinner end of the lead 8 adjacent chip pad 6 and extends a short distanceoutward toward the periphery of encapsulant 18. Fourth surface 8 d iscovered by encapsulant 18. Since third surface 8 c is at an intermediateportion of lead 8, the second surface 8 b, which is exposed at the lowerexterior surface of package 201, is split into two exposed regions bythe encapsulant 18 that covers third surface 8 c. Fourth surface 8 d isformed by etching partially through lead 8 in a manner that leaves theinner end of the exposed inner region of second surface 8 b with arounded profile.

A semiconductor chip 12, into which various electronic circuits areintegrated, is mounted on the center of the first surface 6 a of thechip pad 6 and is attached with a bonding means 22. The semiconductorchip 12 has a plurality of input-output pads 14 formed on an activeupper surface thereof. The bonding of the semiconductor chip 12 to chippad 6 may be performed with common semiconductor chip bonding means,such as common epoxy adhesives, adhesive films or adhesive tapes.

Some or all of the input-output pads 14 of the semiconductor chip 12 areelectrically connected to the first surface 8 a of a respective one ofthe leads 8 by a conductive wire 16 or equivalent conductor. Here, asdescribed above, the first surface 8 a of the lead 8 may be plated witha common metal, such as gold, silver, nickel, palladium, copper orothers to such facilitate bonding.

A hardened body of an adhesive encapsulant material seals the chip pad6, the semiconductor chip 12, the conductive wire 16 and the leads 8.That is, the hardened encapsulant covers the semiconductor chip 12, theconductive wires 16, the sides of the chip pad 6, the first and thirdsurfaces 6 a and 6 c of the chip pad 6, and the first, third surfacesand fourth surfaces 8 a, 8 c and 8 d and the peripheral sides of theleads 8. The second surface 6 b of the chip pad 6 and the two regions ofsecond surface 8 b of the leads 8 are not covered with the encapsulant18 but rather are exposed to the outside in the horizontal plane of thelower exterior surface of the body of encapsulant 18. Depending on thelocation of sawing line S, the outer region of second surface 8 b ofleads 8 can extend beyond the perimeter of encapsulant 18 onto an outerstub of the severed lead 8.

Here, by having third surface 8 c and fourth surface 8 d covered byencapsulant 18, leads 8 are locked to encapsulant 18. Further, by havingthird surface 6 c around exposed second surface 6 b of chip pad 6covered by encapsulant 18, chip pad 6 is locked to encapsulant 18. Thatis, the leads 8 and chip pad 6 are prevented from being separated fromthe encapsulant 18 horizontally or vertically.

Moreover, by having a narrow fourth surface 8 d at the inner end ofleads 8, and by forming a narrow third surface 8 c at an intermediatearea of a longitudinal direction of the lead 8, vibration or bending ofthe lead 8 during the wire bonding or molding process is prevented whilemaintaining a secure lock between encapsulant 18 and leads 8. That is,generally, a vibration or bending of the lead 8 can occur during thewire bonding or molding process. Such vibration or bending can beavoided by forming fourth surface 8 d longitudinally short or,optionally, omitted it altogether. For example in FIGS. 4a, 5a, and 6a ,fourth surface 8 d is fully inward of the point of connection of wire 16to first surface 8 a of lead 8.

There are various methods for forming the body of encapsulant 18. Forexample, the body of encapsulant 18 may be formed using a common plasticmolding technique. In such method, the leadframe is located in atransfer or injection mold and encapsulant material is provided on theupper surface of the leadframe and subsequently cured. The moldingprocess is done in a manner that underfills third surface 6 c of chippad 6 and third and fourth surfaces 8 c and 8 d of leads 8, whileleaving second surface 6 b of chip pad 6 and second surface 8 b of leads8 uncovered and exposed. The encapsulant may be a common epoxy moldingcompound. As examples of molding compounds include NITTO MP-8000AN™molding compound provided by the Nitto Company in Japan and EME 7351 UT™provided by the Sumitomo Company in Japan. A side of the mold istapered, resulting in a taper on the peripheral sides of the body ofencapsulant 18, so that the encapsulated leadframe can be easily removedfrom the mold. Typically, the body of encapsulant 18 is individualized,that is, molded as a distinct unit over each leadframe 18. Accordingly,the leadframe may be sawed or punched around the respective body ofencapsulant 18 along sawing line S through leads 8 inside of frame 2.

Instead of the molding method, a liquid-type encapsulating method may beused. For example, in a first step, the leadframe is located on ahorizontal surface. In a second step, a common contact bead ofhardenable adhesive material, such as HYSOL 4451™ epoxy provided by theDexter-Hysol Company of City of Industry in California, can be coated onthe leadframe to form a closed angle dam at a predetermined area of thelead around the semiconductor chip. In a third step, the bead ishardened by a process, such as heating at a temperature of about 140degrees for an hour. In a fourth step, the hardenable liquid-typeencapsulating material, such as HYSOL™ 4450 liquid type encapsulantmaterial, is poured over the leadframe the inside of the bead to formthe package body. In a final step, the poured liquid-type encapsulant ishardened, for example, by heating at a temperature of about 140 degreesfor an hour. Typically, all leadframes of the strip would beencapsulated in one block of encapsulant, although each leadframe alsocould be encapsulated in an individual block of encapsulant 18.Subsequently, a sawing step is carried out along line S for singulatingthe individual packages from the block of encapsulant over the strip ofleadframes.

Specific areas of the leadframe that are not covered with theencapsulant 18, such as the second surface 6 b of the chip pad 6 and thesecond surface 8 b of the lead 8, may be plated with a common platingmetal or metals, such as gold, nickel, palladium, inconel, solder oflead and tin, or tantalum. Such plating may be performed in the step ofmanufacturing the leadframe. The plated regions may easily be solderedto a motherboard.

Practitioners will appreciate that chip pad 6 can be up set during theencapsulation process, so that second surface 6 c is covered byencapsulant 18 in the semiconductor package.

Referring to FIGS. 5a and 5b , the semiconductor package 202 is verysimilar to package 201 of FIGS. 4a and 4b , having common parts andreference numbers, and hence needs only be described with respect todifferences from the semiconductor package 201.

In semiconductor package 202 of FIGS. 5a and 5b , the leads 8 ofleadframe 102 of FIGS. 3a, 3b, and 3c have a recessed third surface 8 cextending between second surface 8 b and sawing line S adjacent frame 2.As shown in FIG. 5b , the one region of exposed second surface 8 b ofthe lead 8 is located fully within the peripheral sides of the body ofencapsulant 18, since third surface 8 c is covered by encapsulant 18 andis between second surface 8 b and the adjacent package side. An optionalfourth surface 8 d is formed at the inner end of lead 8 opposite thethird surface 8 c at the outer end of the lead 8, such that thirdsurface 8 c and fourth surface 8 d are covered by encapsulant 18.Accordingly, the locking force or binding force between the lead 8 andthe encapsulant 18 is enhanced.

Generally, a bur may be generated by a punching step performed afterencapsulation to singulate an individually encapsulated packages fromthe leadframe strip. The bur (not shown) is directed downward at theline of cut through lead 8. In the case of leadframe 102 and package202, however, the effect of any bur is minimized by providing thirdsurface 8 c at cutting line S and away from second surface 8 b. Any suchbur would therefore be formed at third surface 8 c and not as secondsurface 8 b. Since second surface 8 b is free of any such bur,semiconductor package 202 may be mounted easier to a motherboard.

Referring to FIGS. 3a, 3b, 6a and 6b , the semiconductor package 203made from leadframe 103 is similar to semiconductor package 201 and hassimilarly numbered features. Thus, semiconductor package 203 need onlybe discussed in terms of its differences.

As shown in the drawings, the leadframe 103 and package 203 furtherincludes the flat-type fourth surface 6 d at the bottom of a rectangulargroove formed in the first surface 6 a of the chip pad 6 on which thesemiconductor chip 12 is mounted. Fourth surface 6 d is verticallyrecessed from first surface 6 a, and in this embodiment surrounds chip12.

In one application, one or more input-output pads 14 for ground or someother voltage of the semiconductor chip 12 are electrically connected tothe fourth surface 6 d by a conductive wire 16, as is shown in FIG. 6a .In such an application, bonding means 22 may be electrically insulativeto isolate the backside of chip 12, or bonding means 22 may beelectrically conductive to apply a backside potential to chip 12.Further, the exposed second surface 6 b of chip pad 6 may beelectrically connected by solder, solder paste, or an electricallyconductive adhesive to a ground or other voltage terminal of amotherboard.

By having the fourth surface 6 d located in a groove of first surface 6a of chip pad 6, the chip pad 6 is bonded and bound to the encapsulant18 more strongly because of the increased surface area provided by thegroove. Furthermore, by bonding the conductive wires 16 to fourthsurface 6 c within the groove, the conductive wires 16 are preventedfrom being separated from the fourth surface 6 d of the chip pad 6,which might otherwise occur due to thermal expansion or molding.

Of course, the fourth surface 6 d of the chip pad 6 may be plated with ametal, such as gold, silver, nickel, palladium and copper, so as tostrengthen the bond to conductive wires 16.

In package 302 of FIGS. 6a and 6b , fourth surface 8 d of the lead 8 isformed only at the inner end of the leads 8 adjacent to chip pad 6.There is no third surface 8 c as in semiconductor packages 201 and 202.The exposed second surface 8 b of lead 8 extends longitudinally fromfourth surface 8 c to the outer end of lead 8 that is at or just beyondthe peripheral edge of encapsulant 18.

Practitioners will appreciate that a chip pad 6 having a groove bottomedby a fourth surface 6 d, and one or more conductive wire(s) connectedtherein, as in FIGS. 6a and 6b , could be substituted into thesemiconductor packages 201 and 202.

Therefore, according to embodiments of the present invention, theleadframes semiconductor packages made therewith have leads with one ormore undercuts in its lower surface, thereby forming recessed horizontalsurfaces, which subsequently are underfilled with encapsulant material,thereby improving the bonding force and binding force between the leadand the package body.

Furthermore, the chip pad may have a recessed fourth surface formed inthe upper surface of the chip pad upon which the semiconductor chip ismounted. The fourth surface is in a groove that is encapsulated, therebyimproving the bonding force and binding force between the chip pad andthe encapsulant.

Moreover, to improve the binding force between the leads and theencapsulant, a recessed third surface can be formed across the lead at acenter area of the longitudinal direction of the lead, or at an area oflead adjacent at the side of the package, thereby preventing thevibration or bending of the lead during the wire bonding or moldingprocess and better locking the lad to the package body.

Additionally, if the recessed third surface of the leads is formed wherethe leads are cut by punching during package singulation, then a burthat may be formed during the punching step will not be located on thesecond surface of the lead that is electrically connected to the motherboard. Accordingly, the semiconductor package can be contacted to themother board more closely, thereby increasing the mounting efficiency.

Furthermore, when the recessed fourth surface is formed in a groove inan upper top surface of the chip pad, and one or more wires are bondedto the fourth surface within the groove, then the strong bond betweenthe fourth surface and the encapsulant in the recess helps control theheat expansion and prevent the separation of the conductive wire fromthe fourth surface.

While the present invention has been described with reference to theparticular illustrative embodiments, it is not to be restricted to theembodiments but only by the appended claims. It is to be appreciatedthat those skilled in the art can change or modify the embodimentswithout departing from the scope and spirit of the present invention.

What is claimed is:
 1. A semiconductor package structure comprising: achip pad having first and second opposed surfaces; a plurality of leadseach including an inner end adjacent to the chip pad, an opposite outerend, a first surface, a second surface opposite the first surface, afirst recessed surface that is opposite the first surface and extendsbetween the second surface and the outer end, and a second recessedsurface that is opposite the first surface and extends between thesecond surface and the inner end, and wherein the second surface bisectsthe first recessed surface and the second recessed surface; asemiconductor chip mounted on the first surface of the chip pad and inan electrical connection with at least some of the leads; and a packagebody of a hardened encapsulant material over the chip, the firstsurfaces of the leads, and the second recessed surfaces of the leads,the package body defining a first exterior surface and an exterior sidesurface, wherein the second surface of each of the leads and the secondsurface of the chip pad are exposed through the first exterior surfaceof the package body, and wherein the outer ends of each of the pluralityof leads are exposed through the exterior side surface.
 2. The structureof claim 1, wherein the first recessed surface of each lead begins atthe outer end, and wherein the second surface of each of the leads andthe second surface of the chip pad are substantially flush with thefirst exterior surface of the package body.
 3. The structure of claim 2,wherein the hardened encapsulant materials is over the first recessedsurface of each lead, and wherein the second surface of the chip pad isdevoid of outer terminals.
 4. The structure of claim 2, wherein thesecond recessed surface of each lead begins at the inner end, andwherein portions of each of the leads are exposed through the exteriorside surfaces of the package body.
 5. The structure of claim 1, whereinthe first recessed surface of each lead begins at the outer end, andwherein the first recessed surface of each lead is exposed in the planeof the exterior side surface and exposed in the plane of the firstexterior surface.
 6. The structure of claim 5, wherein the outer end ofeach lead is substantially flush with the exterior first side.
 7. Thestructure of claim 1, wherein the chip pad has a third surface oppositea peripheral portion of the first surface of the chip pad andsurrounding the second surface of the chip pad, the third surface beingrecessed from the second surface.
 8. The structure of claim 1, whereinthe first surface of the chip pad includes a groove having a bottomsurface, the groove extending in a ring adjacent to peripheral sides ofthe chip pad, at least one conductive wire is electrically connectedbetween the semiconductor chip and the bottom surface within the groove,and wherein the groove is filled with the encapsulant material.
 9. Anelectronic package structure comprising: a chip pad having a firstsurface and a second surface opposite a central portion of the firstsurface; a plurality of leads each including an inner end adjacent tothe chip pad, an opposite outer end, a first surface, a second surfaceopposite the first surface a first recessed region that is opposite thefirst surface and that extends inward from the outer end, and a secondrecessed region that is opposite the first surface and that is betweenthe second surface and the inner end, wherein the second surface bisectsthe first recessed region and the second recessed region; an electronicchip mounted on the first surface of the chip pad and in an electricalconnection with the first surface of at least some of the leads; and apackage body of an encapsulant material over the electronic chip, atleast the first surface of the chip pad, the first surfaces of each ofthe leads, and the second recessed regions of each of the leads, whereinthe second surface of each of the leads and the second surface of thechip pad are exposed through and are substantially flush with a firstexterior surface of the package body, and wherein the outer ends of eachof the leads are exposed through a first side exterior surface of thepackage body.
 10. The structure of claim 9, wherein the chip pad furtherincludes a third recessed region opposite a peripheral portion of thefirst surface and surrounding the second surface, and wherein the thirdrecessed region is covered by the encapsulant material, and wherein thesecond surface of the chip pad is devoid of terminal structures.
 11. Thestructure of claim 10, wherein the second recess region of each of theleads begins at the inner end thereof, and wherein portions of each ofthe leads are exposed through the exterior side surfaces of the packagebody.
 12. The structure of claim 9, wherein the outer end of each of theleads is substantially flush with the first side exterior surface of thepackage body.
 13. The structure of claim 9, wherein the first surface ofthe chip pad includes a groove having a bottom surface, the grooveextending in a ring adjacent to peripheral sides of the chip pad, atleast one conductive wire is electrically connected between theelectronic chip and the bottom surface within the groove, and whereinthe groove is filled with the encapsulant material.
 14. The structure ofclaim 9, wherein the encapsulant material is over the first recessedregions of the leads.
 15. A semiconductor package structure comprising:a chip pad having a first surface and a second surface opposite acentral portion of the first surface; a plurality of leads eachincluding an inner end adjacent to the chip pad, an opposite outer end,a first surface, a second surface opposite the first surface a firstrecessed region that is opposite the first surface and that extendsinward from the outer end, and a second recessed region that is oppositethe first surface and that is between the inner end and the secondsurface, wherein the second surface extends completely between the firstrecessed region and the second recessed region so that no portion of thesecond recessed region extends between the second surface and the firstrecessed region; a semiconductor chip mounted on the first surface ofthe chip pad and in an electrical connection with at least some of theleads; and a package body of a hardened encapsulant material over theelectronic chip, at least the first surface of the chip pad, the firstsurfaces of each of the leads, and the second recessed regions of eachof leads, wherein the second surface of each of the leads and the secondsurface of the chip pad are exposed through an exterior surface of thepackage body, and wherein the outer ends of each of the leads areexposed through exterior side surfaces of the package body.
 16. Thestructure of claim 15, wherein the second recessed regions of each ofthe leads begins at the inner end.
 17. The structure of claim 15,wherein the first recessed regions of each of the leads are exposedthrough the exterior surface of the package body and further exposedthrough the exterior side surfaces of the package body.
 18. Thestructure of claim 15, wherein the chip pad includes a third surfaceopposite a peripheral portion of the first surface and surrounding thesecond surface, the third surface being recessed from the secondsurface.
 19. The structure of claim 18, wherein the first surface of thechip pad includes a groove bottomed by a fourth surface, the grooveextending in a ring adjacent to peripheral sides of the chip pad. 20.The structure of claim 15, wherein the encapsulant material is over thefirst recessed regions of each of the leads.